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Skin Matters: Pain from Skin and Wound Conditions: Part 2

October 2006

   Part 1 of this article provided a general approach to skin and wound pain and included a guide to managing painful skin and wound conditions. Part 2 presents a detailed conceptual model that considers pain specific to particular types of chronic wounds as well as management according to wound pain type.

   Conceptual models are developed to help guide clinical practice and critical thinking. The first chronic wound pain model was published by Krasner in 1995.1,2 In 2001, an International Wound Pain Advisory Panel was brought together through an educational grant from Coloplast A/S in Denmark. The international group represents diverse specialties and countries. All members have expertise in pain or wound pain and include: Dr. Karsten Fogh (Denmark), Dr. Chris Glynn (UK), Professor Dr. Michael Junger (Germany), Dr. Bo Jorgensen (Denmark), Dr. Diane L. Krasner (US), Professor Patricia Price (UK), and Dr. R. Gary Sibbald (Canada).

    The cornerstone for the panel’s work is the Wound Pain Management Model (see Figure 1). The model has four levels, which need to be considered simultaneously. Wound assessment and wound pain assessment go hand-in-hand; local wound management and wound pain management go hand-in-hand.

    The International Wound Pain Advisory Panel has published additional enablers, which can be accessed on the following websites: https://www.coloplast.com and https://www.biatain-ibu.coloplast.com.

The Skin Matters series is made possible through the support of the Skin Health Division of Coloplast Corp., Marietta, Ga. This article was not subject to the Ostomy Wound Management peer-review process.

1. Krasner DL. The chronic wound pain experience: a conceptual model. Ostomy Wound Manage. 1995;41(3):20–25.

2. Krasner DL. Caring for the person experiencing chronic wound pain. In: Krasner DL, Rodeheaver GT, Sibbald RG (eds). Chronic Wound Care: A Clinical Source Book for Healthcare Professionals, 3rd edition. Wayne, Pa: HMP Communications;2001:79–89.

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